About Us
Chairman's Message
List of Committee
Photo Gallery
Useful Link
Events / Activities

Multilayer Flexible PCB Printing Technology and Smart Product Research and Development Lunch Seminar

Date, time & venue

2018-04-27;12:30-14:00;Classroom 126, HKPC Building

HKPC has recently introduced the DragonFly 2020 Pro, which is the 3D printing solution on fabricating multilayer and flexible PCB. With its ability to produce prototypes in-house quickly and easily, the solution could greatly enhance the efficiency of high value-add smart products development in multiple industries, such as Biomedical, Automotive, Aviation and Smart Textile etc. HKPC is delighted to have Mr. Udi Zamwel from Israel to introduce the functions and applications of the technology.


The Seminar will discuss the following:-

l  Market prospect in printed electronics

l  Principle of additive manufacturing flexible circuit board

l  Novel technology and materials that overcomes constraints in printed flexible PCB

l  Novel application on printed electronics in different industries

l  Cases and sample sharing

l  Roadmap to support future smart product developments


The fee for this Seminar is in HK$200 (lunch fee included) and the following is the registration link of the Seminar:-


For details, please follow the following link for an introductory video of Dragonfly 2020 Pro:-


For any queries, please contact Mr. Chester Chan (Tel : 2788 5455, Email : or Mr. Brian Mak (Tel : 2788 5799, Email :





  Home | Contact Us | Copyright | Privacy Policy | Disclaimer | Sitemap | Admin
Copyright ©2008 The Hong Kong Institution of Engineers. All rights reserved.