HKPC has recently
introduced the DragonFly 2020 Pro, which is the 3D printing solution on
fabricating multilayer and flexible PCB. With its ability to produce prototypes
in-house quickly and easily, the solution could greatly enhance the efficiency
of high value-add smart products development in multiple industries, such as
Biomedical, Automotive, Aviation and Smart Textile etc. HKPC is delighted to
have Mr. Udi Zamwel from Israel to introduce the functions and applications of
the technology.
The
Seminar will discuss the following:-
l Market prospect in printed
electronics
l Principle of additive
manufacturing flexible circuit board
l Novel technology and
materials that overcomes constraints in printed flexible PCB
l Novel application on printed
electronics in different industries
l Cases and sample sharing
l Roadmap to support future
smart product developments
The fee for this Seminar is in HK$200 (lunch fee included) and the following is the registration link of the Seminar:-
https://events.hkpc.org/v2/form.php?code=DRAGONFLY
For details, please follow the following link for an
introductory video of Dragonfly 2020 Pro:-
https://www.youtube.com/watch?v=xcD2OwBv4r0
For any queries, please contact Mr. Chester Chan (Tel
: 2788 5455, Email : chesterchan@hkpc.org)
or Mr. Brian Mak (Tel : 2788 5799, Email : brianmak@hkpc.org).